"The
Report Global Semiconductor Packaging and Assembly Equipment Market
2016-2020 provides information on pricing, market analysis, shares,
forecast, and company profiles for key industry participants. -
MarketResearchReports.biz"
MarketResearchReports.biz
has made an announcement regarding the addition of a new market
research report to its huge database of research studies. The
research report, titled “Global
Semiconductor Packaging and Assembly Equipment Market
2016-2020,” presents detailed analysis of the market, including
market drivers and restraints, product segmentation, geographical
segmentation, challenges and opportunities, vendor analysis, and
current market trends. The research report has also added valued
inputs and recommendations from professionals and industry experts to
guide existing as well as new players in designing their business
policies efficiently.
According
to the research study, the global market for semiconductor packaging
and assembly equipment is estimated to register a 4.68% CAGR between
2016 and 2020. The research report has further included infographics,
tables, and charts to present the forecast figures as well as the
historical data regarding the market.
Get
Sample Copy Of This Report At :
http://www.marketresearchreports.biz/sample/sample/527337
The
growing demand for semiconductor ICs, growing miniaturization of
electronic devices, rising application of semiconductor ICs in the
IoT, and increasing complexity of semiconductor IC designs are some
of the major factors that are expected to fuel the growth of the
global semiconductor and assembly equipment market in the next few
years. In addition, the rising number of mergers and acquisitions
taking place in the market, increasing adoption of semiconductor ICs
in automobiles, and rising technological developments in the
semiconductor industry are the current market trends that are
boosting the demand for semiconductor and assembly equipment globally
throughout the forecast period.
On
the flip side, for the global market, the fluctuating rates of
foreign exchange are considered as one of the biggest challenges for
the growth of the global semiconductor and assembly equipment market.
In addition, the cyclical nature of the semiconductor industry and
the requirement of heavy investments are expected to hamper the
growth of the global semiconductor and assembly equipment market in
the coming years.
On
the basis of type, the global market for semiconductor and assembly
equipment has been divided into water-level packaging and assembly
equipment and die-level packaging and assembly equipment. The
research report has further included the market share of and revenue
generated from the two types of packaging and assembly equipment.
Based on geography, the global market for semiconductor and assembly
equipment has been categorized into Asia Pacific, Europe, and North
America.
View
Press Release @ http://www.marketresearchreports.biz/pressrelease/486
In
the last section, the global market report for semiconductor and
assembly equipment covers the vendor analysis of the market including
the company profile, inception details, product portfolio, financial
overview, business strategies, SWOT analysis, and recent developments
from the companies. The key vendors operating in the global market
for semiconductor and assembly equipment include Kulicke and Soffa
Industries, Tokyo Seimitsu, TEL, EVG, DISCO, Applied Materials, and
ASMPT. Some of the other vendors mentioned in the research report are
Ulvac Technologies, Suss Microtec, Ultratech, Rudolph Technologies,
and SEMES.
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